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 > Product > Chemical for electronic parts |
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| Process |
Chemical name |
Purpose |
Substrate
(COF/PCB/BGA/BOC) |
DMP-100 |
Ni, Ni-Cr Sputter seed remover |
| PTC-90 |
T-Coating material for protecting Lead of COF |
| FPE-100 |
New etching additive |
| PIE-2000 |
Poly imide(PI) etching (Kapton type) |
| FPC-20, TC-100 |
Tank organic cleaner |
TSP
(Touch Screen Panel) |
PITE-100, 150 |
Crystal ITO etchant |
| TWME-600, PAM-100 |
Ag/Mo, APC metal etchant |
| TWME-810 |
Ag/Ni/Cr metal etchant |
| TME-1000 |
Ni-Cr/Cu/Ni-Cr metal etchant |
| TNCE-100 |
Ni/Cr metal etchant |
| TME-250, TME-400 |
Cu/Ni metal etchant |
| PWE-100 |
APC metal etchant |
| TWME-300, PANE-100, PANE-160 |
Ag nano wire etchant |
| PCPE-100 |
Conductivity molecule etchant |
| PCM-500, 620 |
Cu mesh etchant |
| CIE-100 |
ITO-Cu etchant |
| CIE-200 |
ITO etchant |
| PAMS-10 |
Ag-Mo seed etchant |
| CSR-200 |
Glass Resin&Paste Cleaner |
| SGE-300 |
Graphene substrating ITO etchant |
| Display |
OMEC S-19 |
OLED MASK Cleaner |
| PMC-100, SOC-100 |
Phospher R,G,B remover for OLED MASK Remover |
| PNR-100 |
PR protecting Wafer |
| PHM-1 |
LED Wafer adhesive WAX |
| PPGC-200 |
Organic, inorganic particle cleaner of hardness glass |
| PGE-310 |
Hardned glass etchant |
| PPMC-130 |
Photo Mask cleaner |
| OMECSOL-160, 310 |
OLED Mask cleaner |
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