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| Acid cleaner is mild Etchant based on chloride(Fe2Cl2) for Cu alloy.
Low Etching rate, excellent levelling |
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| Developed for removing Ni, NI-Cr layer (Sputter seed layer)
Effective for preventing over- growth of Tin plating of Ni, Ni-Cr
seed layer on the COF as high etching chemical
Less damage to Cu pattern, High speed removal of Ni, Ni-Cr seed layer |
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| Developed as back coating material used for TAB process.
LPR-325 is Acryl resin containing high wetting ability and excellent in coating capability for copper&polyimide. |
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| OLED RGB phosphor cleaner
It is designed to remove stain rapidly from a metal mask compare with NMP |
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| It is designed to remove stain rapidly from a metal mask
Highly alkaline (base : KOH)
It is suited for electrolytical cleaning
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