| Application Field | Product Group | Product Name | Application |
|---|---|---|---|
| Display | Cleaner | OMEC-S19, 100, C13 | OLED FMM MASK Electrolytic Cleaner |
| Cleaner | OMECSOL-162 | OLED OMM MASK Cleaner (for Al, Organics) | |
| Cleaner | OMECSOL-310 | OLED OMM MASK Cleaner (for AgMg) | |
| Cleaner | AOC-100 | OLED OMM MASK Cleaner (for LiF) | |
| Cleaner | OMSC-100 | Metal Mask Carbide Cleaner | |
| Cleaner | CMSE-100 | Photo Mask Etchant (for Cr) | |
| Cleaner | MSE-100 | Photo Mask Etchant (for MoSi) | |
| Eco-friendly Cleaner | NRC-Series | NMP-Alternative Eco-friendly Cleaner (for Organics) | |
| PCB [Substrate] | Plating Solution | Strike Process | Au Electrolytic Strike Plating Solution |
| Plating Solution | KG-120 Process | Soft Gold & Wire Bonding, Au Electrolytic Plating Solution | |
| Plating Solution | KG-200 Process | Hard Gold, Cobalt-Based Au Electrolytic Plating Solution | |
| Plating Solution | KG-250 Process | Barrel, Cobalt-Based Au Electrolytic Plating Solution | |
| Plating Solution | KG-300 Process | Connector Use, Ni-Based Au Electrolytic Plating Solution | |
| Plating Solution | KS-700 Process | Wire Bonding Ag Plating Solution | |
| Plating Material | E-Form, NSEC-100 | PCB & Electronic Materials, High Purity Sulfamic Acid Nickel | |
| Plating Material | Nickel Sulfate, Nickel Chloride, Boric Acid | For PCB & Electronic Materials, Solid Type | |
| Plating Material | Ni Crown, Pellet | Ni Anode | |
| Plating Additive | SN-20 | Sulfamic Acid Nickel Sulfur-Free Brightener, for Corrosion Resistance Improvement | |
| Plating Additive | SN-100 | Sulfamic Acid Nickel Plating Stress Modifier | |
| Plating Additive | SN-500 | Sulfamic Acid Nickel One-Component Brightener | |
| Plating Additive | SN-1000, 2000 | Sulfamic Acid Nickel Two-Component Brightener | |
| Plating Additive | NP-A | Sulfamic Acid Nickel Anti-Pitting Agent, for Air Agitation & Mechanical Agitation | |
| Plating Additive | Sillux 1000 A, B | Ag Plating Metal-Based High Gloss Additive (for Lead Frame, Metal-Based) | |
| Plating Additive | SN, M1, M2 | Sn Plating Solution Brightener, Semi-Bright/Bright/Sulfate Type | |
| Stripper | DFS-300 | DFR Stripper, Amine Type | |
| Stripper | DPM-100 | DFR/PR Soluble Stripper | |
| Stripper | MS-401 | Sn Stripper | |
| Stripper | TIS-100, 200 | Sn Stripper, Minimal Cu Damage | |
| Stripper | GS-500 | Au Stripper, for Rework | |
| Stripper | AS-300 | Ag Stripper | |
| Stripper | PCS-240, 820 | Cu Immersion Rack Stripper | |
| Stripper | CS-100 | Cu Immersion Stripper, Powder Type | |
| Cleaner | SFBC-100 | Electrolytic Alkaline Degreaser, Low Foaming | |
| Cleaner | CEC-100 | Electrolytic Alkaline Degreaser, Low Foaming, for Cu Oxide Removal | |
| Cleaner | CAC-100 | Spray-Specific Acid Degreaser, No Cu Damage | |
| Cleaner | PAC-200K, SAC-200 | 'Acid Degreaser for PCB, TAB, BGA | |
| Cleaner | PAC-401 | VCP Vertical Line Use, Electro-Copper Plating Degreaser | |
| Cleaner | PCC-502 | RTR Line Use, Electro-Copper Plating Degreaser | |
| Cleaner | DSC-100 | Developing Section Foreign Matter Cleaner | |
| Etchant | DMP-100 | Ni, Ni-Cr Metal Seed Etchant | |
| Etchant | PIE-200 | Polyimide Etchant | |
| Etchant | KCE-50 | Soft Etchant for Cu Alloy | |
| Etchant | KCE-1000 | Soft Etchant for Fe Alloy | |
| Etchant | MFE-5000 | Cu Surface Roughness Adjustment Etchant, One-Component Type | |
| Etching Additive | FPE-600 Series | Cu Etching Factor Improvement Additive | |
| Etching Additive | BCE-100 | Cu Surface Roughness Adjustment Etchant, Three-Component Type | |
| Developer | DFRD-100 | DFR Developer | |
| Sealing Agent | GOS-419, 700 | Immersion Sealing Agent (for Au) | |
| Sealing Agent | Au-XW | Immersion/Electrolytic Sealing Agent (for Au) | |
| Impurity Remover | CRR-22 | Metal Impurity Remover in Au Plating Solution (Cu, Ni) | |
| Semiconductor | Cleaner | PCC-101H, 200H | Reel to Reel, Rack Electrolytic Alkaline Degreaser |
| Cleaner | CBC-100 | Immersion, Ultrasonic Alkaline Degreaser, No Cu Damage | |
| Cleaner | AI-1230, AI-1240 | Electrolytic, Immersion Alkaline Degreaser, Powder Type | |
| Cleaner | AI-419 | Ultrasonic, Immersion Alkaline Degreaser, Powder Type | |
| Stripper | PRS-20 | Positive, Inorganic Salt PR Stripper | |
| Stripper | FPS-100 | Negative, Inorganic Salt PR Stripper | |
| Stripper | WPS-100 | 'Wafer PR Stripper, Positive Organic Solvent Type | |
| Etchant | WTE-100 | Ti, Alkaline Type Metal Etchant for Wafer | |
| Developer | PRD-20 | Positive, Inorganic Salt PR Developer | |
| *RBO Prevention Agent | AR-1(AT), AR-21 | RBO Prevention Agent for Cu, Ag | |
| *RBO Prevention Agent | TR-1 | RBO Prevention Agent for PPF | |
| *RBO Prevention Agent | HP-1 | Rough Cu Use, **PFAS-Free RBO Prevention Agent | |
| *RBO Prevention Agent | HP-2 | PPF Use, PFAS-Free RBO Prevention Agent | |
| *RBO Prevention Agent | AR-51 | PFAS-Free RBO Prevention Agent | |
| Substitution Prevention Agent | PW-600 2T | Ag Substitution Prevention Agent | |
| Anti-Tarnishing Agent | SAT-200 | Ag Anti-Tarnishing Agent | |
| Anti-Tarnishing Agent | SAT-500 | Ag Heat-Resistant Anti-Tarnishing Agent | |
| Anti-Tarnishing Agent | CB-2001, CB-2021 | Cu Anti-Oxidation, Anti-Tarnishing Agent | |
| Anti-Tarnishing Agent | HRFT-100 | 'Sn Heat-Resistant Anti-Tarnishing Agent | |
| Automotive | Adhesive | UA 9201 | Hole Sealing, UV Curable Type |
| Adhesive | TA 6520R | Automotive Encapsulation, Thermosetting Type | |
| Adhesive | TA 7700DM | Automotive Dam, Thermosetting Type | |
| Thermal Grease (TIM) | KC1-2 | 1.8 W/mK Thermal Grease (BLT: 22μm) | |
| Thermal Grease (TIM) | KC2-2 | 2.5 W/mK Thermal Grease (BLT: 20μm) | |
| Thermal Grease (TIM) | KN2-440 | 2.6 W/mK Thermal Grease (BLT: 20μm) | |
| Thermal Grease (TIM) | KN1-15 | 3.0 W/mK Thermal Grease (BLT: 24μm) | |
| Thermal Grease (TIM) | KC3-2 | 3.6 W/mK Thermal Grease (BLT: 22μm) | |
| Thermal Grease (TIM) | KC4-3 | 4.5 W/mK Thermal Grease (BLT: 35μm) | |
| Rust Preventive | SurTec 533 | Temporary Rust Preventive for Iron and Steel | |
| Eco-friendly Cleaner | HSC-400 Series | MC-Alternative Eco-friendly Cleaner | |
| Eco-friendly Cleaner | Uniconex-7700 | TCE-Alternative Eco-friendly Cleaner | |
| Eco-friendly Cleaner | IRC-Series | IPA-Alternative Eco-friendly Cleaner | |
| Cleaner | SurTec 104 | Multi-Purpose Liquid Cleaner | |
| Cleaner | SurTec 138 | Reusable High Concentration Alkaline Cleaner | |
| Cleaner | SurTec 198 | High Concentration Alkaline Liquid Cleaner | |
| Chromate | ZN-Blue-S | Blue, White Zinc Hexavalent Chromate | |
| Chromate | SurTec 650 | Aluminum Trivalent Chromate Agent | |
| Chromate | SurTec 667 | Highly Corrosion Resistant Blue-White Zinc Trivalent Chromate | |
| Chromate | SurTec 680LC | Natural Color Zinc Trivalent Chromate | |
| Mobile | Eco-friendly Cleaner | HSC-900 Series | Fluorine-Based Alternative Non-Flammable, Fast-Drying Cleaner (Organic) |
| Eco-friendly Cleaner | EOC-Series | Anon Alternative Cleaner (Printing Ink) | |
| Adhesive | TA 6900 | Die Attach, Thermosetting Type (Adhesive Material: FR4, Si die) | |
| Adhesive | TA 6880 | Housing Attach, Thermosetting Type | |
| Adhesive | TA 6800FC | IR-Filter Attach, Thermosetting Type (Glass, PET) | |
| Adhesive | UA 8900 | IR-Filter, UV Curable Type (LCP, Glass) | |
| Adhesive | UA 9340 | Lens Fix, UV Curable Type (Glass, LCP) | |
| Adhesive | UVA-HS3 F2 | Solder Sealing, UV Curable Type |
* RBO : Resin bleed out
** PFAS : Per- and polyfluoroalkyl substances (Per- and Polyfluoroalkyl Substances)
