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Process Chemical purpose Feature
Dedreasing /
Cleaning		 PAC-200 Acid cleaner for PCB, TAB, BGA Acid cleaner for PCB process before or after Cu plating to washing on the Cu surface. Useful for removing finger print, oxide PR residue.
PAC-310 Neutral claener PCB Neutral claener PCB process before or after Cu plating to washing on the Cu surface. Useful for removing finger print, oxide PR residue
Soft etching NPE-300 Sodium persulfate type Etchant Sodium persulfate type soft Etchant for the pretreatment of PCB through-Hole before plating
SPS Sodium persulfate type Etchant Sodium persulfate type soft Etchant for Cu electroless plating process
CPE-750 PCB soft Etchant (Hydrogen peroxide type) Soft Etchent for PCB and suited for pretreating of Dry film lamination
KCE-500 PCB soft Etchant (Hydrogen peroxide type) Soft Etchent for PCB process, preteatment of Dry film laminating
Nickel plating E-Form PCB and Electronic part High purity grade sulfamate nickel concentrate designed and manufactured specifically for use in electronic industry microlithography.
SN-1000 Brightener for sulfamate nickel plating Agent of bright sulfamate nickel plating and can use high current density
SN-500 Brightener for sulfamate nickel plating Agent of semi-bright sulfamate nickel plating for PCB, leadframe
NP-A Anti - pitter Anti pitter NP-A is surfactant of lower foaming for sulfamate nickel plating by adding small quantity
SN-pH pH adjust Agent Agent for adjusting(decreasing) of pH in sulfamate nickel plating
Au Strike
 Strike Process Gold strike process Thin plated gold plate Incresing adhesion before gold plating and prevent contamination of gold plating bath
Soft Au Plating KG-120 Process Soft gold plating for wire bonding For wire-bonding, soldering of parts related with electronics industry Pure gold plating on the copper (Direct gold Process)
Hard Au Plating KG-200 Process High speed Acid gold plating process Suitable in high speed plating of electronics parts for connectors, switch, PCB. Very excellent in thermostability and hardness
Au sealing agent Au-XW Au sealing Agent for PCB Possible to be used by dipping & electro type as a sealing agent for Au plating Chemical solution having excellent feature in preventing anti-corrosion and discolor of connector, switch, PCB
Au stripper GS-500 Au stripper Dipping type gold stripper for PCB, connector