| Process |
Chemical |
purpose |
Feature |
| Nickel Plating |
SN-100 |
Residual Stress reducer for sulfamate nickel plating |
Addition agent of bright nickel plating solution and suitable for electroforming, electronic part |
| NP-A |
Anti - pitter |
Anti pitter NP-A is surfactant of lower foaming for sulfamate nickel plating by adding small quantity |
| SN-pH |
pH adjust Agent |
Agent for adjusting(decreasing) of pH in sulfamate nickel plating |
| Palladium plating |
KCP-500 |
Palladium plating For PPF(Pre Plating Frame) |
PPF(Pre Plating Frame) process & Suitable process for Connecter plating
Wide working condition, High uniformity, High covering power |
| Soft gold plating |
KG-120 Process |
Soft gold plating for wire bonding |
For wire-bonding, soldering of parts related with electronics industry
Pure gold plating on the copper (Direct gold Process) |
| Au stripper |
GS-500 |
Au stripper |
Dipping type gold stripper for PCB, connector |
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